FITPAK to Exhibit at PACK EXPO International 2026

 FITPAK is pleased to announce its participation in PACK EXPO International 2026, taking place from October 18–21, 2026, at McCormick Place in Chicago, Illinois, USA.

At one of the packaging and processing industry's leading international events, FITPAK will showcase innovative packaging solutions designed to help protect product freshness and quality.

Throughout the exhibition, our technical team will be available to discuss our high-barrier films, MAP (Modified Atmosphere Packaging) films, retort films, and thermoforming films, and to explore tailored solutions for a wide range of packaging requirements.

Exhibition Details

• Event: PACK EXPO International 2026

• Dates: October 18–21, 2026

• Venue: McCormick Place, Chicago, Illinois, USA

• Hall: Lakeside Lower Exhibits

• Booth: LL-10541

We look forward to meeting industry professionals, discussing your packaging challenges, and introducing our solutions in person.

Visit us at Booth LL-10541. Meetings can be scheduled in advance.